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2010 IEEE RFIC Symposium

Panel Session Day, Time, and Room Number:
Monday May 24th, 2010  
11:50am – 1:20pm
Room Number: TBD

Panel Session Title: The Challenges, Competitions and Future Prospect of 60 GHz

Chair/Organizer/Moderator and Affiliation:
SK Yong, Marvell Semiconductor
Myron Hattig, Intel Corporation

Panelists and Affiliations:

  1. Dr. Jeyhan Karaoguz, Senior Technical Director, Broadcom Corporation
  2. Mr. Myron Hattig, Director of WLAN Standards, Intel Corporation
  3. Mr. Raja Banerjea, Principal Architect, Marvell Semiconductor, Inc.
  4. Mr. Michiaki Matsuo, Senior Manager/Chief Engineer, Panasonic Corporation
  5. Dr. Jisung Oh, Principle Engineer/Director, Samsung Electronics
  6. Dr. Scott Reynolds, Design Manager, IBM TJ Watson Research Center

Sponsors: RFIC

Panel Session Abstract:
The ever growing demand for multi-gigabit data rates to support variety of new applications has pushed to the emergence of 60 GHz radio technology. Significant R&D work in the past decade have demonstrated the viability of wideband 60 GHz CMOS RFIC circuit and transceiver, which were difficult if not impossible to realize in the past, have now become a reality for commercialization. The momentum is further intensified by the heavily harmonized regulations and frequency allocation globally that allow higher EIRP limit and operation of huge unlicensed (i.e. 7 GHz) bandwidth in the 60 GHz band.

As a result, various standards (IEEE 802.11ad and IEEE 802.15.3c) and industry alliances (WirelessHDTM and WiGig Alliance) have emerged to deliver the promise of gigabit wireless solution. Multiple standard solutions could lead to two contradictory effects: On one hand, competition could lead to better 60 GHz products and drives the cost down towards commoditization. On the other hand, competition could create market confusion and co-existence issues among different products if not handled correctly. To date, among the various different standards, only 60 GHz products based on WirelessHDTM solution that supports wireless transmission of full HD contents has reported to hit the high end TV market in Jan 2009. Other 60 GHz products are under rigorous development and in the pipeline for productization. However, the question remains on their timeline in delivering the promise of gigabit experience to the customers.

In addition, Wi-Fi based IEEE 802.11n solution has started to enter the market for audio/video distribution on top of the widespread used of wireless Ethernet. Built strongly upon a broad ecosystem and interoperability among billions of Wi-Fi devices, Wi-Fi centric solution is set to evolve into gigabit data rate range with the recent development in IEEE 802.11.ac. This could potentially yet another solution that serves the similar applications and thus creates competition in market place with 60 GHz. However, the distinct characteristics of Wi-Fi (2.4/5 GHz) and 60 GHz provide a different deployment perspective in which both technologies could be complementary rather than competing to each other. Such complementary technology requires multi-band radios that allow fast and seamless session transfer between them whenever the performance of the current radio deteriorates or an enhanced performance could be achieved.

In this panel, industry leaders and experts will discuss the challenges ahead of full scale commercialization of 60 GHz technology including implementation, tug-of-war among competitive standards, co-existence issues and future direction of 60 GHz.

Panel Session Day, Time, and Room Number:
Tuesday May 25th, 2010  
11:50am – 1:20pm

Panel Session Title: Future of High-Speed I/O: Electrical, Optical, or Wireless?

Chair/ Moderator and Affiliation:
Jacques C. Rudell, University of Washington, Seattle, WA
Sam Palermo, Texas A&M, College Station, TX
Panelists and Affiliations:

  1. Ali Hajimiri: Caltech
  2. Byunghoo Jung:  Purdue University
  3. Jared Zerbe: Rambus Inc
  4. Sam Palermo: Texas A&M, College Station, TX
  5. Ronald Ho: Sun Microsystems, Santa Clara, CA
  6. Daniel Kucharski: Luxtera,  Carlsbad, CA

Sponsors: RFIC

Panel Session Abstract:
The rising power consumption associated with microprocessors realized in nanometer length silicon processes, has placed a fundamental limit on core clock rates. This has lead to new advanced microprocessor architectures which seek to increase computational power by replicating the number of cores on a single die. Processors currently under development are estimated to use as many as 128 cores integrated on the same IC, leaving the routing of data via high-speed signaling from core-to-core, core-to-cache, or core-to-off-chip memory as a critical aspect of modern microprocessor performance. What is the future of high-speed signal? Will the future demand for higher data rate I/Os come through incremental advances of all-electrical integrated transceivers, or will a new breed of high-speed I/O come to life in the form of either integrated optical (nanophotonics) transceivers, or perhaps mmWave wireless transceivers. Come hear a panel of experts debate what the future holds for high-speed signaling.

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Sponsorship opportunity available

Paper Submission Due
7 Jan, 2010

Program book, conference and hotel registration open
2, March, 2010

Final Manuscript Due
2 March, 2010

RFIC 2010
23 - 25 May, 2010

Microwave Journal

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